Capacitors

(001) Passive Electronic Components: 2008-2013 Global Market Outlook
This is the global market analysis for passive electronic components, including capacitors, linear resistors and discrete inductors. Global value, volume and average pricing is given for capacitors by dielectric, resistors by element and inductors by type. Demand is also given in terms of world region and end-use market segment. Market shares by component type are given for FY 2008 Ending March; and technological developments in FY 2008 by manufacturer. Competitive analysis is given for the top 18 global manufacturers of passive components and forecasts are given to 2013. This is a complete update to the 2007 report of the same name. This report also looks at new technology developments by manufacturer and component type and makes some interesting conclusions based upon tactical technology changes for 2009 affecting passive components and the markets into which they are sold. This study is detailed in unit shipment data, as well as value and ASP data. Each component is individually tracked and includes ceramic, aluminum, tantalum, DC film, AC film capacitors; thick film chip, network, array, IPD, nichrome, wirewound, tin-oxide, carbon resistors; and wirewound chip coil and ferrite bead, array and multilayered chip inductors. Forecasts to 2013 worldwide.

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Product Code: CRL08
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(002) NEW! Paper & Plastic FILM Capacitors: World Markets, Technologies & Opportunities: 2008-2013
This global market research study analyzes global value and volume of demand for both AC film and DC film capacitors. The AC film capacitor market focuses on global value and volume of demand for small and large can polypropylene dielectric capacitors, including both dry and oil-filled designs for use in electrical systems (motor run, microwave oven, magnetic ballast, power transmission and distribution and true power film capacitors (i.e. variable speed drive, furnace, traction). The second part of the study focuses on DC film capacitors for printed circuit board applications in power supply, lighting ballast, and consumer AV applications, and includes value and volume of demand for 5 mm pitch PET film capacitors; AC & Pulse film capacitors, X & Y film capacitors and PPS, PEN and PET film chip capacitors. The competitive environment is given including market shares by type and dielectric and forecasts to 2013.

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Product Code: FILM08
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(01) Passive Electronic Components: 2007-2011 Global Market Outlook
This report was designed for end-users of passive electronic components who need to update their supply chain information for passive parts on an annual basis.This report was designed with input from major purchasers of passive electronic components and in direct response to industry needs. Which Components Are Tracked In This Report? This report forecasts global consumption volume, value and pricing for capacitors, resistors and inductors, including MLCC, Aluminum, Tantalum, DC Film and AC Film Capacitors; Thick Film Chip Resistors, Resistor Networks, Integrated Passive Devices; Metal Film Resistors, Tin-Oxide Resistors, Wirewound Resistors, Carbon Film Resistors; Metal Oxide Varistors, NTC Thermistors; PTC Thermistors; Multilayered Chip Inductors; and Wirewound Inductor Coils. Who Is Discussed In This Report? All major vendors of Passive Components are discussed in this report, including AVX/Kyocera Corporation (NYSE: AVX : RIC 6971:), EPCOS AG (NYSE: EPC), Kemet Electronics (NYSE: KEM): KOA Corporation (RIC: 6999), Nichicon Corporation (RIC 6996); Nippon Chemi-Con Corporation (RIC: 6997), Panasonic Electronic Devices Company Limited (RIC: 6752), Murata Manufacturing Limited (RIC: 6981), Rohm Company Limited (RIC 6963) , Rubycon Corporation (Private), Samsung Electro-Mechanical (KSE: 009150):, Sumida Electric Company Limited (RIC: 6817), Taiyo Yuden Corporation (RIC: 6976), TOKO Inc. (RIC: 6801), Tokin Corporation/NEC (RIC: 6795), Vishay Intertechnology, Inc. (NYSE: VSH), Walsin Technology (TT: 5335) and Yageo Corporation (TW: 2327). What Are Some of The Major Conclusions Of The Report?: The report makes future price forecasts for each passive component based upon position in the five-year cycle; current capacity expansion, higher raw material prices (Nickel, Aluminum, Copper, Ruthenium, Tantalum) and forecasted demand over the next five years for consumption in wireless handsets, personal computers, television sets and home theatre; automotive electronics and more.

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Product Code: CRL2007
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(02) Conductive Polymer Capacitors: World Markets: Technologies & Opportunities: 2006-2010

F O C U S O F T H E R E S E A R C H R E P O R T :

This is a primary research report that covers significant market research data regarding conductive polymers used as cathodes in solid tantalum and aluminum electrolytic capacitors. The report also includes coverage on liquid polymer aluminum capacitor markets as well, and the emerging use of conductive polymers in niobium and double layer carbon capacitors.

R E A S O N F O R T H E R E P O R T :

This report is time sensitive as it documents and forecasts the coming changes in the conductive polymer capacitor market and how these devices will become increasingly more standardized for general purpose applications in multiple end-use market segments.

Solid polymer versions of these devices that employ a conductive polymer will continue to displace older technologies such as manganese nitrate and liquid electrolytes. There is confusion among the many aluminum capacitor vendors, tantalum capacitor vendors, and polymer materials suppliers about which is the most cost effective method for developing quality low ESR solid electrolytic capacitors. There are also issues of health and safety that are causing vendors and customers to move toward conductive polymer cathodes.

B E N E F I T S O F T H E R E P O R T :

The report is based upon primary intelligence provided from leading experts in the industry for the purposes of this report. Since many vendors are either ramping up production of conductive polymer product lines in 2006 or expanding their capabilities in the segment,

there are many questions about what production method achieves the best product in terms of performance ratios; and which conductive polymer offers the best cathode coverage at the best price. The study also documents the cost savings associated with changing the polythiophene ( PEDOT ) and polppyyrole dipping processes from nine dips to five dips to 1 dip processes. The study also looks at additional new conductive polymers that are gradually finding their way into the market as sealers, but are now being experimented with for complete cathode. The study also discusses and compared how matching systems in other dielectrics proved fundamental and how matching systems for solid conductive polymer capacitors is also needed now and to 2010.

P R O D U C T F O C U S O F T H E R E P O R T :

C o n d u c t i v e P o l y m e r T a n t a l u m

C o n d u c t i v e P o l y m e r A l u m i n u m

L i q u i d P o l y m e r A l u m i n u m

P o l y m e r N i o b i u m a n d P o l y m e r E D L C

C o n d u c t i v e P o l y m e r s

M a t c h i n g S y s t e m s

P r o d u c t i o n P r o c e s s e s

N e w C a t h o d e M a t e r i a l s : 2 0 0 6 - 2 0 1 0

 


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Product Code: POLYCAP06
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(01) Passive Electronic Components: 2007-2011 Global Market Outlook
This report was designed for end-users of passive electronic components who need to update their supply chain information for passive parts on an annual basis.This report was designed with input from major purchasers of passive electronic components and in direct response to industry needs. Which Components Are Tracked In This Report? This report forecasts global consumption volume, value and pricing for capacitors, resistors and inductors, including MLCC, Aluminum, Tantalum, DC Film and AC Film Capacitors; Thick Film Chip Resistors, Resistor Networks, Integrated Passive Devices; Metal Film Resistors, Tin-Oxide Resistors, Wirewound Resistors, Carbon Film Resistors; Metal Oxide Varistors, NTC Thermistors; PTC Thermistors; Multilayered Chip Inductors; and Wirewound Inductor Coils. Who Is Discussed In This Report? All major vendors of Passive Components are discussed in this report, including AVX/Kyocera Corporation (NYSE: AVX : RIC 6971:), EPCOS AG (NYSE: EPC), Kemet Electronics (NYSE: KEM): KOA Corporation (RIC: 6999), Nichicon Corporation (RIC 6996); Nippon Chemi-Con Corporation (RIC: 6997), Panasonic Electronic Devices Company Limited (RIC: 6752), Murata Manufacturing Limited (RIC: 6981), Rohm Company Limited (RIC 6963) , Rubycon Corporation (Private), Samsung Electro-Mechanical (KSE: 009150):, Sumida Electric Company Limited (RIC: 6817), Taiyo Yuden Corporation (RIC: 6976), TOKO Inc. (RIC: 6801), Tokin Corporation/NEC (RIC: 6795), Vishay Intertechnology, Inc. (NYSE: VSH), Walsin Technology (TT: 5335) and Yageo Corporation (TW: 2327). What Are Some of The Major Conclusions Of The Report?: The report makes future price forecasts for each passive component based upon position in the five-year cycle; current capacity expansion, higher raw material prices (Nickel, Aluminum, Copper, Ruthenium, Tantalum) and forecasted demand over the next five years for consumption in wireless handsets, personal computers, television sets and home theatre; automotive electronics and more.

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Product Code: CRL2007
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(02) Ceramic Capacitors: World Markets: 2005-2010
This is a global market analysis of ceramic capacitors by configuration including MLCC, MLC Axial, MLC Radial, and Single Layer Specialty parts. The study analyzes historical trends in terms of global consumption by configuration, performance (X7R, X5R, X8R, Y5V, Z5U, NPO, and others); case size (01005, 0201, 0402, 0603, 0805, 1206, 1210 and above); world region, competitive environment, market shares, lead times, prices and price trends, regional shifts in consumption and forecasts to 2010.

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Product Code: CCAP05
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(03) BME MLCC: Global Markets, Technologies & Opportunities: 2005-2010
This study analyzes the global market for high capacitance MLCC greater than 2.2 microfarad and the materials and manufacturing methods used in its production worldwide. The study traces the market from its mass commercialization by TDK in 1993 through the myriad of global vendors who have convert6ed to the process in 1995/1996. The market is broken down by electrode system (nickel, palladium, silver), termination system (copper, silver, tin), dielectric matching system in X5R, X7R and Y5V configurations (Hydrothermal barium titanate, oxalate Barium Titanate; alk-oxide barium titanate, and solid state gel BT for nanomaterial sizes particles for 1000+ ;ayer systems in EIA case sizes. Global market shares and a complete competitive analysis among global Japanese, Korean, Chinese, German and American vendors are compared. Forecasts for growth are given through 2010.

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Product Code: BME05
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(04) Capacity Expansion In The Global Ceramic Capacitor Industry: 2007
This report reconciles forecasted capacity expansion in units by ceramic capacitor manufacturer, with forecasted consumption by end-use market segment and concludes where too much capacity is being added and where too little is planned. Why This Report Is Important: This report is important because it is being released at a time when there is a substantial amount of concern within the supply chain and from the financial community about the ceramic capacitor market performing as planned. This study takes a complete look at the demand side of the equation, and then correlates the customers needs with the planned capacity expansion in MLCC technology (High Cap) and MLCC case size (Ultra-Small) and a different picture emerges, one where certain companies selling MLCC are expanding their production bases in accordance with customer demands; and others are expanding to keep in step with their competitors. This results in an interesting disparity- too much capacity for a single end-use market segment, and not enough for other market segments. Scope of The Report: This capacitor industry report is intended to be the most comprehensive and useful technical–economic analysis available on multilayered ceramic chip capacitor markets, manufacturers and their planned capacity expansion for 2007. The study addresses the planned capacity expansion by manufacturer in key segments, with emphasis upon high capacitance MLCC in the X5R, X7R and Y5V market segments; and the expansion in the ultra-small case size MLCC in 01005, 0201 and 0402 MLCC case sizes. The study also addresses consumption trends in end-use product markets for 2007 with emphasis upon high MLCC content product markets, such as “converged” handsets; flat panel display HDTV; dual core microprocessors and automotive electronic subassemblies; and other important specialty segments. Who Is Discussed In This Report: All major vendors of MLCC are discussed in this report, including Murata Manufacturing Limited (RIC: 6981) • TDK Corporation (RIC: 6762) • Yageo Corporation (TW: 2327) • Kyocera/AVX Corporation (RIC: 6791; NYSE: AVX) • Walsin Technology Corporation • Samsung EMCO (KSE: 009150) • Taiyo Yuden Corporation (RIC: 6979) • Panasonic Electronic Devices • Kemet Elecronics (NYSE: KEM) • Ghuangdong Fenghua Advanced Technology (SZN: 000636) • Holy Stone Enterprise Company Limited (TW: 5345) • Team Young Advanced Ceramics Company Limited (TW: 5345) • EPCOS Austria (NYSE: EPC) • Vishay Migdel Haamek (NYSE: VSH) • Rohm Company Limited (RIC: 6963), as well as their materials vendors,

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Product Code: CAPEXMLCC2007
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