Resistors

(01) Resistor Markets in North America: 2007-2014 Outlook
This 76 page report details the United States, Canada and Mexico markets for fixed, linear resistors, including chips, networks, arrays, and throughole resistors (wirewound, tin, nichrome, TaN, carbon) resistors for consumption in a variety of computer, auto, telecom, industrial and defense related markets. Forecasts to 2014.

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Product Code: RESNAFTA07
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(1) Thick Film Chip Resistors: Global Market Outlook: 2007-2011
This report analyzes the global market for thick film chip resistors. The report includes global value and volume of consumption for thick film chip resistors, and average unit selling price data for the years 1991 through 2007 with forecasts to 2011. The study also breaks down the market based upon demand by case size, end-use market segment; and also breaks out demand based upon power rating, tolerance and wattage. Trends and directions are discussed; as well as detailed competitive data for the major volume producers. Forecasts to 2011. Published September 2007, 102 Pages.

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Product Code: TFC2007
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(2) Resistors: World Markets, Technologies & Opportunities: 2004-2008
This 2004 to 2008 market analysis includes 390 pages covering every aspect of both the linear and non-linear resistor markets worldwide. Linear resistor markets include thick film ruthenium chip, resistor network, resistor array, wirewound resistor, nichrome metal film resistor, bulk metal foil resistor, wirewound resistor, carbon film resistor, tantalum nitride resistors and the defunct carbon composition resistors; and the non-linear resistor segment covers PTC thermistors, NTC thermistors and metal oxide varistors. The study contains all available market data associated with a high level market research rport including consumption by configuration, case size, type; region, number of units, value of units, prices and price trends, competitive environment by technology; sales and market shares, technology changes and forecasts to 2008.

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Product Code: GLOBR05
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(3) LTCC Components & Modules: World Markets, Technologies & Opportunities: 2002-2007 Technical-Economic Analysis.
A global market research analysis on electronic components & modules manufactured from Low-Temperature Co-Fired Ceramic (LTCC) tapes and related materials. The study focuses on the supply chain for LTCC components and modules, including glasses and filler materials for tapes and metallization for conductivity; as well as co-fired capacitor, resistor and inductor materials for use between the interconnecting ceramic layers of the LTCC 3-dimensional module or component. The study also describes in detail the multi-layered production process for LTCC; and each individual end-use market in which these devices are consumed, with emphasis upon wireless handsets and automotive electronic subassemblies. Additional established, and emerging markets in telecom infrastructure, computer, defense and medical electronics is also addressed. Pricing and price trends are discussed as well as competition from integrated passive devices and FR4 modules is also discussed. Competition by market segment; market shares and complete intelligence on the competitive supply chain is given. Forecasts to 2007- a one of a kind report.

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Product Code: LTCC02
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Chip Resistors: World Markets, Technologies & Opportunities: 2004-2008
This study focuses on the global market for thick and thin film resistor chips, with emphasis upon thick film precious metal resistors composed of ruthenium or a ruthenate compound over a 96% ceramic alumina substrate. The study, analyzes global consumption by case size, tolerance, voltage rating, and power rating. The study addresses average unit price declines and forecasts the same through 2006. A competitive analysis is offered with all major participants, their unit market share and dollar market value. Forecasts to 2008.

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Product Code: CHIPR04
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Thin Film Resistor Chip, Network and Array: Global Markets 2004-2008
This study addresses the global market for thick and thin film resistor networks and multichip arrays. The study focuses on demand by type, with emphasis upon dual-in-line package (DIP), single-in-line package (SIP), multichip array, and thin film integrated passive devices. Packaging issues are addressed (molded chip versus BGA) as is demand by circuit configuration (bussed, isolated, R2R Ladder networks and RC networks). Trends are given in demand in the array segment with respect to quads and octels, as well as castellated designs. Global value and volume of consumption by world region and end-use market segment is addressed as is the competitive environment (thick film versus thin film); and forecasts to 2008.

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Product Code: RNETS04
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Throughhole Resistors: World Markets: 2004-2008
This report offers a detailed analysis of the value-added throughole resistor market which has traditionally been dominated by Vishay, Panasonic and TT Electronics; and includes nickel-chromium (NiChrome) metal film resistors; wirewound resistors; flame proof tin oxide resistorss (Antimony 10), bulk metal foil; carbon film resistors and the defunct carbon composition resistors. The study looks at the largely industrial electronic environments where these unique resistors are used because of their power handling, voltage and high resistance capabilities. Demand by type, configuration (axial and radial) and resistance value is analyzed as well as competition, market shares and the overall competitive encironment in the value-added portion of the fixed resistor business. Forecasts to 2008.

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Product Code: RTHRU04
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