Resistors Market Reports & Publications

This 76 page report details the United States, Canada and Mexico markets for fixed, linear resistors, including chips, networks, arrays, and throughole resistors (wirewound, tin, nichrome, TaN, carbon) resistors for consumption in a variety of computer, auto, telecom, industrial and defense related markets. Forecasts to 2014. ISBN # 1-893211-86-1 (2007)

This 2004 to 2008 market analysis includes 390 pages covering every aspect of both the linear and non-linear resistor markets worldwide. Linear resistor markets include thick film ruthenium chip, resistor network, resistor array, wirewound resistor, nichrome metal film resistor, bulk metal foil resistor, wirewound resistor, carbon film resistor, tantalum nitride resistors and the defunct carbon composition resistors; and the non-linear resistor segment covers PTC thermistors, NTC thermistors and metal oxide varistors. The study contains all available market data associated with a high level market research rport including consumption by configuration, case size, type; region, number of units, value of units, prices and price trends, competitive environment by technology; sales and market shares, technology changes and forecasts to 2008 ISBN # 1-893211-24-X (2004).

A Market Research Analysis Covering World Markets, Technologies & Opportunities For Infrared Detectors and Related Devices and a Look At Investment Opportunities In The Sector Who Stand To Benefit Over The Next Five Years. Main Components Covered: o Cooled and Uncooled Focal Plane Arrays Main Markets Covered o Thermal Imaging Cameras o Thermography Instruments o Consumer Electronics Markets Analyzed o Defense & Homeland Security o Industrial Temperature Measurement o Consumer Audio and Video Imaging o Emerging Markets ISBN # 1-893211-43-6 (2004)

This global market study takes a detailed look at the major economic thrusts behind integration and modularization of passive components.  The driving sprit behind the integration of passive electronic components has been volumetric efficiency of handheld digital electronics that continue to be stymied by the ever-increasing content of passive components for bypass, decoupling, filtering, energy storage/discharge and circuit protection.  Customers in wireless handsets and laptop computers have driven demand for integration, but engine control units and medical implants have played an important role as well in the drive toward greater volumetric efficiency.  In order to increase throughput of manufacturing at the customer level; lower pick and place costs, reduce test time and lower inventories the concept of modularization has caught on, especially in handsets.  There are three primary choices for integration for the design engineer- thin film integrated passive, FR4 module and LTCC module.  This analysis looks at the success and the failures of each of these three product categories and forecast their future growth. ISBN # 1-893211-61-4 (2003)