Integrated Passive Devices: World Markets: 2003-2008

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This Zogbi global market analysis provides a detailed look at major economic thrusts behind integration and modularization of passive components.

Integrated Passive Devices: World Markets: 2003-2008

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This global market study takes a detailed look at the major economic thrusts behind integration and modularization of passive components. The driving sprit behind the integration of passive electronic components has been volumetric efficiency of handheld digital electronics that continue to be stymied by the ever-increasing content of passive components for bypass, decoupling, filtering, energy storage/discharge and circuit protection. Customers in wireless handsets and laptop computers have driven demand for integration, but engine control units and medical implants have played an important role as well in the drive toward greater volumetric efficiency. In order to increase throughput of manufacturing at the customer level; lower pick and place costs, reduce test time and lower inventories the concept of modularization has caught on, especially in handsets. There are three primary choices for integration for the design engineer- thin film integrated passive, FR4 module and LTCC module. This analysis looks at the success and the failures of each of these three product categories and forecast their future growth.
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